发明名称 Child-resistant carded blister package and method of manufucture
摘要 A carded package includes a front card bonded to a rear card with a blister card captured therebetween. The blister card has upstanding blister compartments projecting through openings of the front card. The rear card extends over an opposite face of the blister card and is a laminate including a tear-resistant polymeric layer bonded to a paperboard layer. The polymeric layer extends adjacent the blister card and the paperboard layer of the laminate extends remote from the blister card forming an exposed surface of the rear card. The rear card includes perforations aligned behind the blister compartments. The perforations include a first set of perforations cut entirely through the paperboard and polymeric layers and a second set of perforations cut into the paperboard layer and not into or entirely through the polymeric layer. A method of assembling a carded package is also disclosed.
申请公布号 US8328018(B2) 申请公布日期 2012.12.11
申请号 US20100939330 申请日期 2010.11.04
申请人 SACK RYEN;KNUTSON CURTIS A.;ANDERSONBRECON INC. 发明人 SACK RYEN;KNUTSON CURTIS A.
分类号 B65D83/04 主分类号 B65D83/04
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