发明名称 Electronics package with radial heat sink and integrated blower
摘要 According to one aspect of the invention, an electronics package includes an enclosure and one or more thermal energy generating components disposed in the enclosure. A radial heat sink is disposed in the enclosure including a blower disposed in the radial heat sink and a plurality of fins extending from a periphery of the blower toward a perimeter of the radial heat sink. The plurality of fins define a plurality of channels having a plurality of channel exits at the perimeter of the radial heat sink. The radial heat sink configured to dissipate thermal energy from the one or more components which are arranged around the heat sink according to heat flux requirements of each component. An air inlet extends through the enclosure and is connected to the blower to direct air to the blower in a direction substantially perpendicular to the first longitudinal face and/or the second longitudinal face.
申请公布号 US8331091(B2) 申请公布日期 2012.12.11
申请号 US20100873508 申请日期 2010.09.01
申请人 KASLUSKY SCOTT F.;ST. ROCK BRIAN;HAMILTON SUNDSTRAND CORPORATION 发明人 KASLUSKY SCOTT F.;ST. ROCK BRIAN
分类号 H05K7/20 主分类号 H05K7/20
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