发明名称 Semiconductor device having recessed gate electrode and method of fabricating the same
摘要 In a semiconductor device having a recessed gate electrode and a method of fabricating the same, a channel trench is formed in a semiconductor substrate by etching the semiconductor substrate. A first semiconductor layer is formed on the semiconductor substrate that fills the channel trench. A second semiconductor layer is formed on the first semiconductor layer, the second semiconductor layer having a lower impurity concentration than the first semiconductor layer.
申请公布号 US8329539(B2) 申请公布日期 2012.12.11
申请号 US20060429890 申请日期 2006.05.08
申请人 HA DAE-WON;LEE KONG-SOO;LEE SUNG-SAM;LEE SANG-HYUN;SHIM MIN-YOUNG;SAMSUNG ELECTRONICS CO., LTD. 发明人 HA DAE-WON;LEE KONG-SOO;LEE SUNG-SAM;LEE SANG-HYUN;SHIM MIN-YOUNG
分类号 H01L21/336;H01L21/8242 主分类号 H01L21/336
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