发明名称 APPARATUS AND MOTHOD FOR TREATING SUBSTRATE
摘要 <p>PURPOSE: An apparatus and method for processing a substrate are provided to improve a processing ratio of the substrate since the substrate directly enters a second processing from a chamber to a transfer module without passing through a load lock chamber. CONSTITUTION: A robot transferring a substrate between a container and a process module is provided to a transfer module. The process module comprises a transfer chamber, a load lock chamber(1310), a first process chamber(1330), and a second process chamber(1340). The robot transferring the substrate is provided to the transfer chamber. The load lock chamber is arranged between the transfer chamber and the transfer module. The first process chamber performs first processing while being arranged to be separated from the transfer module at the circumference of the transfer chamber. The second process chamber performs second processing while being arranged at the circumference of the transfer chamber.</p>
申请公布号 KR20120133965(A) 申请公布日期 2012.12.11
申请号 KR20110082678 申请日期 2011.08.19
申请人 发明人
分类号 H01L21/677 主分类号 H01L21/677
代理机构 代理人
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