| 摘要 |
A micromachined thermal and mechanical isolator for MEMS die that may include two layers, a first layer with an active temperature regulator comprising a built-in heater and temperature sensor and a second layer having mechanical isolation beams supporting the die. The isolator may be inserted between a MEMS die of a disc resonator gyroscope (DRG) chip and the leadless chip carrier (LCC) package to isolate the die from stress and temperature gradients. Thermal and mechanical stress to the DRG can be significantly reduced in addition to mitigating temperature sensitivity of the DRG chip. The small form can drastically reduce cost and power consumption of the MEMS inertial sensor and enable new applications such as smart munitions, compact and integrated space navigation solutions, with significant potential cost savings over the existing inertial systems. |
