发明名称 PLATING AFTERTREATMENT DEVICES EQUIPPED VIBRATION MODULE AND PLATING AFTERTREATMENT METHOD
摘要 PURPOSE: A plating post-treatment apparatus with a vibration module and a plating post-treatment method using the same are provided to remove the deterioration of endurance due to the vibration of a vibration module by using the buffer effect of a spring. CONSTITUTION: A plating post-treatment apparatus comprises a vibration module, a guide unit(30), and a container(20). The vibration module comprises a frame, a vibrating motor, and a first spring(15). The frame includes a support plate on which the vibrating motor is installed, an upper plate(115) located at the top of the vibrating motor, and a first fastening member whose one end is fixed to the support plate and the other is inserted into a through hole(113) of the upper plate. The first spring is attached to the frame and provides elasticity. The guide unit comprises a guide bar(31) inserted to a pair of guide holes(117) of a guide plate(33) and a second fastening member(35) whose one end is fixed to the upper plate and the other is movably connected to the guide plate. The container is connected to the underside of the vibration module and accommodates an object to be plated.
申请公布号 KR101211220(B1) 申请公布日期 2012.12.11
申请号 KR20120067221 申请日期 2012.06.22
申请人 WOO SHINENG CO., LTD. 发明人 KIM, SUNG MAN
分类号 C25D17/00;C23C2/26;C25D5/48 主分类号 C25D17/00
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