发明名称 DEVICE AND METHOD OF INSPECTING BONDED PLATE-LIKE BODY
摘要 <P>PROBLEM TO BE SOLVED: To provide a bonded plate-like body inspection device capable of obtaining an inspection image that can show bubbles and foreign matters in adhesive and the state of adhesive in the surrounding area even if there is a light non-transmitting area around the bonded plate-like body. <P>SOLUTION: A bonded plate-like body inspection device comprises a line sensor camera 50, first illumination means 51 that illuminates the surface of a bonded plate-like body 10 from a first plate-like body 11 side of the bonded plate-like body 10, and second illumination means 52 that illuminates from a second plate-like body 12 side of the bonded plate-like body 10 toward the line sensor camera 50. The first illumination means 51 obliquely illuminates, from above the bonded plate-like body 10, a predetermined area E<SB POS="POST">L</SB>extending in a direction along a photographing line L<SB POS="POST">C</SB>from a point at a predetermined distance from the photographing line L<SB POS="POST">C</SB>on the surface of the bonded plate-like body 10. In the state illuminated by the first illumination means 51 and the second illumination means 52, an inspection image is produced as the line sensor camera 50 scans the bonded plate-like body 10. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012242142(A) 申请公布日期 2012.12.10
申请号 JP20110109951 申请日期 2011.05.16
申请人 SHIBAURA MECHATRONICS CORP 发明人 HAYASHI YOSHINORI;WAKABA HIROYUKI;IZUTSU TADASHI;SEKI KATSUTOSHI;ONO YOKO;GONDO TAKANORI
分类号 G01N21/95 主分类号 G01N21/95
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