| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve transfer connection with a conductive member without causing a short-circuiting defect between electrodes, and prevent conduction failure due to crack of the conductive member. <P>SOLUTION: In a connection structure in which a first electrode formed on a top surface of a first substrate and a second electrode formed on a top surface of a second substrate attached to the top surface of the first substrate are connected to each other with a conductive member, the outer size of the second substrate is smaller than that of the first substrate, the first electrode is disposed around the second substrate on the first substrate, a space is formed between the first substrate and the second substrate at the periphery of the second substrate, an insulation resin is disposed in the vicinity of the first electrode so as to cover a part of a side surface of the second substrate and fill the space between the first substrate and the second substrate, and the conductive member is disposed in a region ranging from the first electrode of the first substrate to the second electrode of the second substrate over the insulation resin. <P>COPYRIGHT: (C)2013,JPO&INPIT |
