| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for an optical semiconductor device which is excellent in light transmittance and also light resistance. <P>SOLUTION: The epoxy resin composition for the optical semiconductor device contains a silicone resin (D) and a polyhydric alcohol (E), together with an epoxy resin (A), an acid anhydride curing agent (B) and a curing accelerator (C). In the silicone resin (D), a siloxane unit constituting the silicone resin is expressed by general formula (1): R<SB POS="POST">m</SB>(OR<SP POS="POST">1</SP>)<SB POS="POST">n</SB>SiO<SB POS="POST">(4-m-n)/2</SB>, hydroxyl group or an alkoxy group coupled to at least one silicon atom is contained in one molecule, and 10 mol% or more of substituted or unsubstituted aromatic hydrocarbon group is contained in monovalent hydrocarbon groups (R) coupled to the silicon atom. In the formula, R represents 1-18C substituted or unsubstituted monovalent saturated hydrocarbon groups or aromatic hydrocarbon groups, and may be the same or different from each other, R<SP POS="POST">1</SP>represents hydrogen atoms or 1-6C alkyl groups, and may be the same or different from each other, and m and n are 0-3 of integers respectively. <P>COPYRIGHT: (C)2013,JPO&INPIT |
