| 发明名称 |
THERMOSETTING RESIN COMPOSITION, MEMBER FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE USING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a member for a semiconductor device which is excellent in gas barrier properties and adhesiveness. <P>SOLUTION: The thermosetting resin composition includes the following (A)-(D), in which the total of epoxy equivalents of (A) polysiloxane and (B) epoxy compound contained in the thermosetting resin composition is 200-700 g/equiv., and the storage elastic modulus at 150°C based on dynamic viscoelasticity measurement of a cured product formed by thermally treating the thermosetting resin composition is 1.00×10<SP POS="POST">7</SP>-1.60×10<SP POS="POST">9</SP>Pa. (A) Polysiloxane having an epoxy equivalent of polysiloxane of 250-1,000 g/equiv. and represented by the following formula (1): (R<SP POS="POST">1</SP>R<SP POS="POST">2</SP>R<SP POS="POST">3</SP>SiO<SB POS="POST">1/2</SB>)<SB POS="POST">a</SB>(R<SP POS="POST">4</SP>R<SP POS="POST">5</SP>SiO<SB POS="POST">2/2</SB>)<SB POS="POST">b</SB>(R<SP POS="POST">6</SP>SiO<SB POS="POST">3/2</SB>)<SB POS="POST">c</SB>(SiO<SB POS="POST">4/2</SB>)<SB POS="POST">d</SB>(OR<SP POS="POST">7</SP>); (B) epoxy compound; (C) curing agent; and (D) curing catalyst. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2012241059(A) |
申请公布日期 |
2012.12.10 |
| 申请号 |
JP20110110430 |
申请日期 |
2011.05.17 |
| 申请人 |
MITSUBISHI CHEMICALS CORP |
发明人 |
TANAKA TOSHIYUKI;ANDO MASATO;SAWAMURA TOSHIYUKI;WATABE TAKUMI;UENO NOBUHIKO |
| 分类号 |
C08G59/22;C08G77/14;H01L33/56 |
主分类号 |
C08G59/22 |
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