发明名称 SEMICONDUCTOR CHIP AND INSPECTION METHOD THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor chip and an inspection method for the semiconductor chip enabling inspecting a semiconductor chip, having an installed communication circuit for handling high frequency signals, with high accuracy using a low-cost inspection device. <P>SOLUTION: A semiconductor chip having a plurality of installed functional blocks functioning as communication circuits includes, in one functional block to be inspected, a test signal supply circuit for supplying frequency signals for testing and an external output circuit for detecting the signal intensity of a signal generated by the functional block and for externally outputting an intensity signal indicative of the signal intensity. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012244335(A) 申请公布日期 2012.12.10
申请号 JP20110111329 申请日期 2011.05.18
申请人 LAPIS SEMICONDUCTOR CO LTD 发明人 TAYA TAKASHI
分类号 H04B17/00;G01R31/28 主分类号 H04B17/00
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