| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a process liquid for migration layer formation for forming a migration suppression layer capable of improving insulation reliability between electric wiring by suppressing migration of copper ions between electric wiring. <P>SOLUTION: The process liquid for migration suppression layer formation contains azole compound and water, has a dissolved oxygen amount of 8 ppm, and is used to form a migration suppression layer that suppresses ion migration in copper wiring or copper alloy wiring. <P>COPYRIGHT: (C)2013,JPO&INPIT |
