| 摘要 |
PURPOSE: A light emitting device package is provided to prevent that a wire bonding part of a lead frame is cut by fixing a wire using a boding ball in the wire bonding. CONSTITUTION: A light emitting device(130) is placed on a first lead frame(121). A first wire(170) electrically connects a second lead frame(122) and an electrode pad(150). A first bonding ball(190) is placed on the second lead frame while be separated from a first contact point(180). The first bonding ball electrically connects the first wire and the second lead frame. A pad ball(160) is placed on the electrode pad. A second bonding ball(195) is placed on the first bonding ball. |
