| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting element package having a new structure. <P>SOLUTION: A light emitting element package according to one embodiment of the present invention includes: a body including a cavity with an opened topside and comprising a ceramic material; a heat dissipation member arranged in a region between a bottom surface of the cavity and a lower surface of the body, in the body; a plurality of electrodes arranged on the bottom surface of the cavity; a plurality of pads arranged on the lower surface of the body and electrically connected to the electrodes; a light emitting diode which is arranged on any one of the electrodes arranged on the bottom surface of the cavity and is electrically connected to the electrodes; and a buffer layer arranged between the heat dissipation member and at least one of the pads and having a thickness thinner than that of the heat dissipation member. <P>COPYRIGHT: (C)2013,JPO&INPIT |
