| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting element in which an LED and a protection diode are formed on the same substrate, and having a configuration suitable for flip-chip mounting. <P>SOLUTION: A light emitting element is provided in which an LED is formed in an LED region X and a protection diode is formed in a protection diode region Y. An LED anode electrode 51a and a protection cathode electrode 52b face each other across an isolation trench Z, and an LED cathode electrode 52a and a protection diode anode electrode 51b face each other across the isolation trench Z. When a p-side electrode 51 is equal in thickness to a n-side electrode 52, the LED anode electrode 51a and the LED cathode electrode 52a in the LED region X are equal in height to the protection diode anode electrode 51b and the protection diode cathode electrode 52b in the protection diode region Y. <P>COPYRIGHT: (C)2013,JPO&INPIT |
