| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device in which particles attached to wafers can be removed, and the individual wafers can be distinguished in each manufacturing process. <P>SOLUTION: Attachment of particles 32 to a front side can be prevented by disposing a recess 9 serving as a stamp at a peripheral part 6 of a rear surface 3 instead of the front side. In a grinding step for the rear surface 3, the recess 9 as a stamp part remains to ensure distinction of a wafer 2 by thinning an inner side of the rear surface 3 with grinding while allowing the peripheral part 6 to remain thick. At the same time, the particles 32 attached during the grinding step are removed from the rear surface 3 of the wafer 2 in an element formation region 8. Consequently, the wafer 2 can be distinguished at any time until the manufacturing processes are completed. Additionally, a yield rate of semiconductor devices can be improved owing to elimination of the attachment of the particles 32 to a surface 10 of the wafer 2 during stamping. <P>COPYRIGHT: (C)2013,JPO&INPIT |
