PREPREG, LAMINATED BOARD USING THE SAME AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a prepreg maintaining excellent workability and insulation performance and having excellent thermal conductivity, a laminated board using the prepreg and a printed wiring board.

SOLUTION: The prepreg is configured by impregnating or coating a glass fiber base material obtained by processing a (C) silane compound having a phenylamino group with a resin composition including (A) thermosetting resin and (B) aluminum oxide. The laminated board is laminated and formed by using the prepreg, and the printed wiring board is formed by wiring the laminated board.

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