| 摘要 |
<p>PURPOSE: A semiconductor package and a manufacturing method thereof are provided to electrically connect penetrating electrodes by not perpendicularly arranging the penetrating electrodes of laminated semiconductor substrates. CONSTITUTION: A first substrate(100) has a first side and a second side facing with the first side. A second substrate(200) passes through the first substrate. The second substrate has a first side and a second side facing the first side. A second penetrating electrode(230) passes through the second substrate. An insulating pattern(250) is placed between the second side of the first substrate and the first side of the second substrate. A connection pattern(271) is electrically connected to the first penetrating electrode and the second penetrating electrode.</p> |
