发明名称 |
OXIDE SPUTTERING TARGET AND METHOD OF MANUFACTURING THE SAME, AND BUFFER POWDER USED THEREFOR |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an oxide sputtering target which can be prevented from breakage when cooled after sintering, a method of manufacturing the same, and buffer powder used therefor. <P>SOLUTION: The method includes a step of forming a compressed body containing metal oxide powder which expands when cooled after sintering, a step of placing the compressed body in a mold, filling buffer powder to the outer circumference of the compressed body in the mold and performing hot-processing in this state to manufacture an oxide sintered body 4 to form an oxide sputtering target. The buffer powder 3 is sintered by the heating of the hot-processing, and the sintered body derived from the buffer powder 3 is broken by the expansion of the oxide sintered body 4 when it is cooled after the sintering. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012241218(A) |
申请公布日期 |
2012.12.10 |
申请号 |
JP20110110946 |
申请日期 |
2011.05.18 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
CHO SHUHIN;SHIRAI TAKANORI;SUGIUCHI YUKIYA;SAITO ATSUSHI |
分类号 |
C23C14/34;C04B35/00;C04B35/48;C04B35/64;C04B35/645;G11B7/243;G11B7/254;G11B7/257;G11B7/26 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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