发明名称 OXIDE SPUTTERING TARGET AND METHOD OF MANUFACTURING THE SAME, AND BUFFER POWDER USED THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide an oxide sputtering target which can be prevented from breakage when cooled after sintering, a method of manufacturing the same, and buffer powder used therefor. <P>SOLUTION: The method includes a step of forming a compressed body containing metal oxide powder which expands when cooled after sintering, a step of placing the compressed body in a mold, filling buffer powder to the outer circumference of the compressed body in the mold and performing hot-processing in this state to manufacture an oxide sintered body 4 to form an oxide sputtering target. The buffer powder 3 is sintered by the heating of the hot-processing, and the sintered body derived from the buffer powder 3 is broken by the expansion of the oxide sintered body 4 when it is cooled after the sintering. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012241218(A) 申请公布日期 2012.12.10
申请号 JP20110110946 申请日期 2011.05.18
申请人 MITSUBISHI MATERIALS CORP 发明人 CHO SHUHIN;SHIRAI TAKANORI;SUGIUCHI YUKIYA;SAITO ATSUSHI
分类号 C23C14/34;C04B35/00;C04B35/48;C04B35/64;C04B35/645;G11B7/243;G11B7/254;G11B7/257;G11B7/26 主分类号 C23C14/34
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