发明名称 |
MULTILAYER FILM STRUCTURE AND FORMATION METHOD THEREOF |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a new multilayer film structure and a formation method thereof. <P>SOLUTION: A formation method of a multilayer film structure for semiconductor elements includes: a semiconductor layer formation step of forming a semiconductor layer composed of a germanium tin mixed crystal on a substrate containing silicon; a surface protection layer formation step of forming a surface protection layer on the semiconductor layer; a semiconductor strain application layer formation step of forming a semiconductor strain application layer composed of a silicon germanium tin mixed crystal by advancing solid-phase reaction with a substrate containing the germanium tin mixed crystal and the silicon by performing heat treatment for the semiconductor layer; a removal step of removing the surface protection layer; and a lamination step of laminating a strain semiconductor layer above the semiconductor strain application layer after the removal step. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012244069(A) |
申请公布日期 |
2012.12.10 |
申请号 |
JP20110115089 |
申请日期 |
2011.05.23 |
申请人 |
NAGOYA UNIV |
发明人 |
NAKATSUKA OSAMU;ZAIMA SHIZUAKI;MOCHIZUKI KENTA;SHIMURA YOSUKE |
分类号 |
H01L21/20;H01L21/203;H01L21/205;H01L21/336;H01L29/786 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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