发明名称 MULTILAYER FILM STRUCTURE AND FORMATION METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a new multilayer film structure and a formation method thereof. <P>SOLUTION: A formation method of a multilayer film structure for semiconductor elements includes: a semiconductor layer formation step of forming a semiconductor layer composed of a germanium tin mixed crystal on a substrate containing silicon; a surface protection layer formation step of forming a surface protection layer on the semiconductor layer; a semiconductor strain application layer formation step of forming a semiconductor strain application layer composed of a silicon germanium tin mixed crystal by advancing solid-phase reaction with a substrate containing the germanium tin mixed crystal and the silicon by performing heat treatment for the semiconductor layer; a removal step of removing the surface protection layer; and a lamination step of laminating a strain semiconductor layer above the semiconductor strain application layer after the removal step. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012244069(A) 申请公布日期 2012.12.10
申请号 JP20110115089 申请日期 2011.05.23
申请人 NAGOYA UNIV 发明人 NAKATSUKA OSAMU;ZAIMA SHIZUAKI;MOCHIZUKI KENTA;SHIMURA YOSUKE
分类号 H01L21/20;H01L21/203;H01L21/205;H01L21/336;H01L29/786 主分类号 H01L21/20
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