| 摘要 |
<P>PROBLEM TO BE SOLVED: To connect a semiconductor package component and a substrate with durability and strength while maintaining solder joint quality. <P>SOLUTION: When a semiconductor package component 3 is mounted on a substrate 1, and an adhesive agent is applied between the substrate 1 and a peripheral part of the semiconductor package component 3, an adhesive agent 6a is applied on the substrate 1 as a first application, and an adhesive agent 6b is applied thereon as a second application so as to connect the peripheral part of the semiconductor package component 3 and the adhesive agent 6a. Thereafter, reflow is carried out to cause solder melting. After the adhesive agents 6a and 6b are cured, solder joint is coagulated. In this case, a relationship between a cross-sectional area S1 of an adhesive agent part 60a of the first application and a cross-sectional area S2 of an adhesive agent part 60b of the second application satisfies S1≤S2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
