| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device by relaxing stress applied to a semiconductor chip. <P>SOLUTION: A semiconductor device (20) includes a wiring substrate (22) having a primary surface (22a), a semiconductor chip (24) disposed on the primary surface of the wiring substrate, and an adhesive layer provided between the primary surface (22a) of the wiring substrate (22) and a rear surface (24b) of the semiconductor chip (24). The adhesive layer is composed of at least a piece of an adhesive member (26) interposed between the primary surface (22a) of the wiring substrate (22) and the rear surface (24b) of the semiconductor chip (24) so as to form a gap (38). <P>COPYRIGHT: (C)2013,JPO&INPIT |
