| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a surface treatment agent achieving favorable soldering properties by forming a chemical conversion coating excellent in heat resistance and wettability with solder on a surface of copper or a copper alloy constituting a circuit part or the like of a printed wiring board, when joining an electronic component or the like with the printed wiring board using solder; a surface treatment method; a printed wiring board; and a soldering method. <P>SOLUTION: Surface treatment is performed on a surface of copper or an copper alloy using a surface treatment agent containing a specified imidazole compound. <P>COPYRIGHT: (C)2013,JPO&INPIT |
