发明名称 DIE FEEDING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a die feeding device capable of quickly performing die takeout work. <P>SOLUTION: A die feeding device 1 comprises: a negative pressure line 2; an atmospheric pressure line 3; a valve 4 capable of switching the negative pressure line 2 and the atmospheric pressure line 3; a suction stage 5 including a suction hole 53 which is communicated with the valve 4 and sucks a back surface of an area C1 where a die 93 to be a takeout object is stuck to a front surface in a dicing film 91 by a negative pressure of the negative pressure line 2, and a pin 54 which projects a part C2 of the area C1 to the front side in the state that the area C1 is sucked and projects the die 93 while peeling the dicing film 91 to a position where the die 93 is taken out by a suction nozzle 95; and a shared drive part 6 for linking a switching operation of the valve 4 and forward and backward movement operations of the pin 54 at prescribed timing. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012244024(A) 申请公布日期 2012.12.10
申请号 JP20110114359 申请日期 2011.05.23
申请人 FUJI MACH MFG CO LTD 发明人 IWAKI NORIAKI;HAMANE TAKESHI
分类号 H01L21/67;H01L21/301;H01L21/52 主分类号 H01L21/67
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