发明名称 MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing apparatus and a manufacturing method capable of manufacturing electronic components with excellent productivity. <P>SOLUTION: The manufacturing apparatus comprises: a first member; a second member; and a displacement mechanism. The first member has a first surface layer consisting of an elastic body. The second member consists of an elastic body, and has a second surface layer facing the first surface layer while spaced apart therefrom. The first surface layer 13 and the second surface layer are configured so that the interval therebetween is narrowed toward the end of the first member in a second direction y, at both ends in the second direction y perpendicular to a first direction x. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012243896(A) 申请公布日期 2012.12.10
申请号 JP20110111225 申请日期 2011.05.18
申请人 MURATA MFG CO LTD 发明人 KUNIMOTO KAZUNORI;YAMADA HISAHIRO
分类号 H01G13/00;H01G4/12;H01G4/252;H01G4/30 主分类号 H01G13/00
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