| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a socket for an electronic component having an electronic component such as an IC chip mounted therein, in which shield performance to an intermediate member interposed between the electronic component and a main substrate is improved. <P>SOLUTION: An electronic component support part 5a by which an electronic component 30 is supported and a connection member mounting part 6a on which a connection member 20 is mounted are provided in an insulating housing 2. A first metal plate 3 and a second metal plate 4 are provided between the component support part 5a and the connection member mounting part 6a, and an intermediate terminal 10 is held by through-holes 7 and 8 formed in respective metal plates 3 and 4 via an insulator 15. A side part shield surface 3c is folded to the first metal plate 3, and a side part of the connection member mounting part 6a is covered with the side part shield surface 3c. The connection member 20 allows enhancing a shield effect by covering the upper surface and the side part with the metal plate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
