THERMOSETTING RESIN COMPOSITION, PREPREG AND LAMINATE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition from which a prepreg having high thermal conductivity can be manufactured, as the prepreg obtained by impregnating glass fiber cloth with the resin composition shows a small reduction in the thermal conductivity, and to provide a prepreg and a laminate using the resin composition.

SOLUTION: The thermosetting resin composition is obtained by compounding an epoxy resin expressed by specified general formula (1) with a phenolic compound having a repeating structure expressed by specified general formula (2) and/or a repeating structure expressed by specified general formula (3).

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