发明名称 MANUFACTURING METHOD OF ELECTRONIC APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To positively remove foreign matters from the inside of an airtight container in the manufacturing method of an electronic apparatus in which an electronic device is enclosed in the airtight container. <P>SOLUTION: A plurality of container members 3, 4 housing an electronic device therein are temporarily aligned with each other with a clearance d interposed to assemble an airtight container 2. With the airtight container erected with a suction hole 7 located at the lower side, a dust-suction process for suctioning the inside from the suction hole by dust-suction means 5 while tapping from both sides of the airtight container to produce vibration is executed. During the process, the electronic device inside is grounded at the same time. Then, a sealing process for sealing the container members to manufacture the airtight container 2 is executed, and air in the container is discharged to seal the container. The volume of foreign matters in the airtight container is decreased, lowering the defective rate. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012243575(A) 申请公布日期 2012.12.10
申请号 JP20110112643 申请日期 2011.05.19
申请人 FUTABA CORP 发明人 SHIRAISHI NOBUAKI
分类号 H01J9/26;H01L23/02 主分类号 H01J9/26
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