| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for housing piezoelectric vibration element and a piezoelectric device that are excellent in thickness reduction and impact resistance. <P>SOLUTION: A package for housing piezoelectric vibration element comprises: an insulating substrate 101 that has a flat plate part 118, a frame part 117 provided on the flat plate part 118, and a projection part 107 projected from the inner face of the frame part 117 to the inside of the frame part 117, with the upper face of the frame part 117 and the upper face of the projection part 107 at the same height; a frame-shaped metalized layer 108 provide on the upper face of the frame part 117; and a connection conductor 109 provided on the upper face of the projection part 107 as separated from the frame-shaped metalized layer 108, on which a piezoelectric vibration element 102 is mounted. On the upper face of the projection part 107, which is at the same height as the upper face of the frame part 117, the connection conductor 109 is disposed as separated from the frame-shaped metalized layer 108. Therefore, securement of the distance between the piezoelectric vibration element 102 and the upper face of the flat plate part 118 and reduction of thickness are facilitated. <P>COPYRIGHT: (C)2013,JPO&INPIT |
