发明名称 SEMICONDUCTOR LIGHT-EMITTING ELEMENT, NITRIDE SEMICONDUCTOR WAFER, AND METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR LAYER
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element that suppresses the degradation and destruction of a semiconductor layer, a nitride semiconductor wafer, and a method of manufacturing a nitride semiconductor layer. <P>SOLUTION: A semiconductor light-emitting element includes a first semiconductor layer, a light-emitting part, a second semiconductor layer, and an In-containing intermediate layer. The first semiconductor layer is formed above a silicon substrate via a substrate layer, contains a nitride semiconductor, and has a first conductivity type. The light-emitting part is provided above the first semiconductor layer and includes a plurality of barrier layers and well layers that are provided between the adjacent plurality of barrier layers and contain Ga<SB POS="POST">1-z1</SB>In<SB POS="POST">z1</SB>N. The second semiconductor layer is provided on the light-emitting part, contains a nitride semiconductor, and has a second conductivity type. The In-containing intermediate layer is provided at least either between the first semiconductor layer and the light-emitting part or between the second semiconductor layer and the light-emitting part, contains a nitride semiconductor containing In having a different composition ratio from the z1, and has a thickness of 10 nm or more and 1000 nm or less. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012243814(A) 申请公布日期 2012.12.10
申请号 JP20110109783 申请日期 2011.05.16
申请人 TOSHIBA CORP 发明人 HUANG JONG-IL;SHIODA MICHIYA;HUNG HUNG;SUGIYAMA NAOJI;NUNOUE SHINYA
分类号 H01L33/12;H01L21/205;H01L33/32;H01S5/323 主分类号 H01L33/12
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