| 发明名称 |
SILICONE-MODIFIED EPOXY RESIN COMPOSITION, PHOTOSEMICONDUCTOR SEALING COMPOSITION AND PHOTOSEMICONDUCTOR ELEMENT ADHESIVE CONTAINING THE RESIN COMPOSITION |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition which can give a cured product good in heat resistance, UV resistance, and storage stability. <P>SOLUTION: There is provided an epoxy resin composition containing a silicone-modified epoxy resin having the structure of general formula (1) [wherein R<SP POS="POST">1</SP>and R<SP POS="POST">2</SP>are each a specified organic group; and Y is an organic group containing a cyclic ether group]. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2012241136(A) |
申请公布日期 |
2012.12.10 |
| 申请号 |
JP20110114123 |
申请日期 |
2011.05.20 |
| 申请人 |
KYOCERA CHEMICAL CORP |
发明人 |
MIYAMOTO MANA;KIKUCHI TOMONAO |
| 分类号 |
C08G59/20;H01L21/52;H01L23/29;H01L23/31;H01L33/56 |
主分类号 |
C08G59/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
