| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED lighting device capable of improving heat radiation efficiency of a substrate. <P>SOLUTION: The LED lighting device 1,100 has a substrate 10,110 on which an LED element 11,111 for emitting light is mounted. The LED element 11,111 is mounted on the surface 10a, 110a side of the substrate 10,110, and has a contact part 31,131 which is in surface contact with the rear face 10b, 110b of the substrate 10,110, and is provided with a heat radiation member 30,130 to radiate heat of the substrate 10,110 through the contact part 31,131. Further, a heat conduction agent 40 of semi-liquid formed of metallic fine powder or carbon fine powder is interposed between the rear face 10b, 110b side of the substrate 10,110 and the contact part 31,131 of the heat radiation member 30,130. <P>COPYRIGHT: (C)2013,JPO&INPIT |
