| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the generation of an unpolished part in a workpiece like a silicon wafer. <P>SOLUTION: The polishing apparatus includes a surface plate on which a polishing pad is mounted, and a head 20 having a suction face 21S on a face facing the polishing pad. Furthermore, the head 20 includes flow paths 31 (25), 32 (26) of first and second systems for vacuum sucking, and a plurality of sucking holes 33, 34 communicating with the suction face 21S from the respective flow paths. The polishing apparatus further includes flow path switching means 40, 41, 42 which selectively switch the respective flow paths 31 (25), 32 (26) of the first and second systems and making one of them effective. <P>COPYRIGHT: (C)2013,JPO&INPIT |
