| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component built-in module and a manufacturing method of the component built-in module, capable of suppressing via flow which can be a cause of an electric connection defect. <P>SOLUTION: The manufacturing method of a component built-in module includes: a formation step of forming a via hole 402 filled with conductive paste, a cavity 403 with a built-in electronic component 404 and a gap 405 for adjustment on a sheet member 401 containing a resin; and a hot press step of abutting the sheet member 401 to a substrate and performing hot press. The gap 405 for adjustment formed in the formation step is formed such that a flow vector Ea of the resin during the hot press near the via hole 402 toward the electronic component 404 is canceled by a flow vector Eb of the resin during the hot press near the via hole 402 toward the gap 405 for adjustment. <P>COPYRIGHT: (C)2013,JPO&INPIT |
