发明名称 TEMPERATURE DETECTION WAFER
摘要 <P>PROBLEM TO BE SOLVED: To provide a temperature detection wafer which can prevent the damage or a break of a thermocouple, and make the whole thickness uniform. <P>SOLUTION: A temperature detection wafer for a temperature monitor of a wafer pasting device, puts a thermocouple for measuring temperature between two dummy wafers and bonds the dummy wafers each other, thereby fixing the thermocouple to the dummy wafers. The thermocouple is configured by a sheathed thermocouple 20 in which a thermocouple wire 22c is disposed in a sheath tube 22a through an insulation material 22b. A part of the sheathed thermocouple 20 which is sandwiched by the two dummy wafers 11 and 12 is made to be a flat portion 22 having a generally fixed thickness in a direction orthogonal to surfaces of the dummy wafers 11 and 12. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012242227(A) 申请公布日期 2012.12.10
申请号 JP20110112178 申请日期 2011.05.19
申请人 HUGLE INTERNATIONAL INC;NIHON NETSUDENKI SEISAKUSHO:KK 发明人 YAMADA YUJI;WARASHI SHUNICHI
分类号 G01K1/14;G01K7/02 主分类号 G01K1/14
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