| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for forming holes in a backside dielectric layer of solar cells for fabrication of rear point contact. <P>SOLUTION: The backside of a dielectric layer 105, 110 is coated with a carbon layer 120. A shadow mask 125 is placed over the carbon layer 120 and reactive ion etch (RIE) is used to transfer holes 130 in the shadow mask 125 to the carbon layer 120, to thereby form a carbon mask. The shadow mask 125 is then removed and RIE is used to transfer holes 140 from the carbon mask to the dielectric layer 105, 110. The carbon mask is then removed by, e.g., ashing. <P>COPYRIGHT: (C)2013,JPO&INPIT |
