发明名称 |
LED LEAD FRAME WITH REFLECTOR, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED lead frame with a reflector that is prevented from warping back to deform even after a resin reflector is formed, and a method of manufacturing a semiconductor device using the lead frame. <P>SOLUTION: An LED lead frame 1 with a reflector includes: a base material 2 having a plurality of mounting regions MA for mounting LED elements 8 which are arranged in matrix, and a resin reflector formation region RA where a resin reflector 3 is provided surrounding circumferences of the plurality of mounting regions MA; a linear resin reflector non-formation part 4 which is positioned on a dicing line DL in the resin reflector formation region RA; and the resin reflector 3 which is provided in a region in the resin reflector formation region RA except the resin reflector non-formation part 4. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012244086(A) |
申请公布日期 |
2012.12.10 |
申请号 |
JP20110115512 |
申请日期 |
2011.05.24 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
UCHIDA YASUHIRO;SUZUKI TSUNAICHI;KAWAI KENZABURO;MURATA YOSHINORI;ODA KAZUNORI |
分类号 |
H01L33/60 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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