| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a liquid processing apparatus capable of washing deposit inside a processing chamber and a washing method of the liquid processing apparatus. <P>SOLUTION: In a liquid processing apparatus 1 for processing a wafer W with liquid comprises: a wafer support member 10 capable of horizontally supporting and rotating the wafer W; a cover 20 for covering the upper part of the wafer support member 10 and forming a processing chamber S for liquid-processing the wafer W together with the wafer support member 10; an elevating/lowering mechanism 132 for elevating and lowering the cover 20 between an opening position for opening an outer peripheral part 23 of the cover 20 and an outer peripheral part 13 of the wafer support member 10 and a closing position for closing them; a liquid supply member 30(40) disposed inside the processing chamber S, for supplying processing liquid to the rotated wafer W; and a controller 70 for setting the position of the cover 20 to the closing position in the state of not supporting the wafer W by the wafer support member 10, supplying a prescribed amount of washing liquid inside the processing chamber S by the liquid supply member 30(40), and then changing the position of the cover 20 to the opening position. <P>COPYRIGHT: (C)2013,JPO&INPIT |
