| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a semiconductor device which can optionally adjust a desired stand-off height and perform lead processing. <P>SOLUTION: As shown in the figure 1, an apparatus for manufacturing a semiconductor device includes: a device receiving die 30 for housing a semiconductor device 1 with a lead 5; a bending die 10 arranged on an outer side and a lower side with respect to the device receiving die 30 and contacted by a flat part of the lead 5; a bending punch 110 arranged so as to face the bending die 10 and molding the lead 5 by sandwiching it with an upper surface of the bending die 10; and position adjustment means 60 for adjusting the height difference between the device receiving die 30 and the bending die 10. <P>COPYRIGHT: (C)2013,JPO&INPIT |
