| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a MEMS relay capable of enhancing mass productivity while suppressing warpage of a movable part where armatures are stacked. <P>SOLUTION: A magnetic material wafer(first wafer) provided with a plurality of magnetic material units each including a frame 5, an armature and a coupling part of the frame 5 and armature is bonded, in wafer level, to one silicon wafer(second wafer) from which a plurality of movable blocks 2 are formed, and to one SOI wafer(third wafer) from which a plurality of cover substrates 3 are formed, at a bonding temperature lower than the melting temperature of the armature. Subsequently, the coupling part is removed thus separating the frame 5 and the armature. <P>COPYRIGHT: (C)2013,JPO&INPIT |
