| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem that, in a transfer mold method using a molding die as a method of encapsulating a semiconductor device, a sufficient amount of resin material including not just a resin amount equivalent to the cubic volume of cavities but also a resin amount to be filled in runners needs to be prepared, and that, since the resin body formed in the runners is ultimately cut off from the finished product, some of the resin materials used is wasted. <P>SOLUTION: In a semiconductor device manufacturing method, a planar substrate having a number of unit device regions is accommodated between an upper and a lower mold so that the unit device regions respectively will correspond to a number of mold cavities formed between the two molds, in which way the unit device regions each are encapsulated with resin. In such a semiconductor device manufacturing method, the invention applied herein aims to carry out resin encapsulation by supplying a resin tablet to portions corresponding to the respective mold cavities to reduce the thickness of at least part of the mold cavities including a pot portion. <P>COPYRIGHT: (C)2013,JPO&INPIT |
