发明名称 |
SUSPENSION SUBSTRATE, SUSPENSION, SUSPENSION WITH ELEMENT, AND HARD DISK DRIVE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a suspension substrate having high connection reliability between a terminal part of a wiring layer and a terminal part of a heat-assist element. <P>SOLUTION: In the suspension substrate according to the present invention, the wiring layer includes a heat-assist wiring layer to be connected to the heat-assist element which is disposed on a metal support substrate side. The heat-assist wiring layer is electrically connected to a terminal part by a conductor part formed in the thickness direction, the terminal part comprising the metal support substrate, insulated from the peripheral metal support substrate and connected to the heat-assist element. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012238357(A) |
申请公布日期 |
2012.12.06 |
申请号 |
JP20110106523 |
申请日期 |
2011.05.11 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
ONUKI MASAO;YAMAZAKI TAKESHI;YAMADA JUNICHI |
分类号 |
G11B5/60;G11B5/31 |
主分类号 |
G11B5/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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