发明名称 SUSPENSION SUBSTRATE, SUSPENSION, SUSPENSION WITH ELEMENT, AND HARD DISK DRIVE
摘要 <P>PROBLEM TO BE SOLVED: To provide a suspension substrate having high connection reliability between a terminal part of a wiring layer and a terminal part of a heat-assist element. <P>SOLUTION: In the suspension substrate according to the present invention, the wiring layer includes a heat-assist wiring layer to be connected to the heat-assist element which is disposed on a metal support substrate side. The heat-assist wiring layer is electrically connected to a terminal part by a conductor part formed in the thickness direction, the terminal part comprising the metal support substrate, insulated from the peripheral metal support substrate and connected to the heat-assist element. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012238357(A) 申请公布日期 2012.12.06
申请号 JP20110106523 申请日期 2011.05.11
申请人 DAINIPPON PRINTING CO LTD 发明人 ONUKI MASAO;YAMAZAKI TAKESHI;YAMADA JUNICHI
分类号 G11B5/60;G11B5/31 主分类号 G11B5/60
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