发明名称 MULTILAYER SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a multilayer substrate which takes effective measures against a noise component. <P>SOLUTION: A multilayer substrate comprises: a first surface layer and a second surface layer each including a conductive pattern; a ground layer provided between the first and second surface layers; a power source layer provided between the first and second surface layers; a via hole formed to penetrate between the conductive pattern of the first surface layer and the conductive pattern of the second surface layer; and a conductive pad formed to connect to the via hole in any of the first surface layer and the second surface layer. The conductive pad has a capacity of 3 PF to 5 PF. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012238688(A) 申请公布日期 2012.12.06
申请号 JP20110105996 申请日期 2011.05.11
申请人 FUNAI ELECTRIC CO LTD 发明人 NAKANISHI NOBUHITO
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
代理机构 代理人
主权项
地址