发明名称 COOLING OF ELECTRONIC COMPONENTS IN AN ENCLOSURE
摘要 The present invention concerns an enclosure (100, 900, 1 100, 1200) and a cooling unit (1 10, 310, 410, 510, 610, 910, 1010, 1 110, 1210) for connection to such an enclosure. The enclosure comprising heat generating equipment (235). The cooling unit comprises a plurality of heat exchangers (120) arranged in parallel and adjacent to an air outlet/inlet (105a, 105b) of the enclosure. Air heated by the heat generating equipment is to be induced between the heat exchangers and guided through the heat exchangers by air guides connecting adjacent heat exchangers. The heat exchangers will absorb heat from the heated air and expel the absorbed heat from the vicinity of the enclosure.
申请公布号 WO2012166031(A1) 申请公布日期 2012.12.06
申请号 WO2011SE50691 申请日期 2011.06.01
申请人 TELEFONAKTIEBOLAGET L M ERICSSON (PUBL);AABERG, GOERAN 发明人 AABERG, GOERAN
分类号 H05K7/20;F28D1/02;F28F9/22 主分类号 H05K7/20
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