SEMICONDUCTOR CHIP AND STORAGE DEVICE

摘要

A semiconductor chip comprising a packaging encapsulant (10) and a leadframe (11) comprising chip pins (111), and characterized in that: the semiconductor also comprises a control integrated circuit chip (121), a storage integrated circuit chip (122), and at least one passive component (123). The control integrated circuit chip (121) is electrically connected respectively to the chip pins (111), the storage integrated circuit chip (122), and the at least one passive component (123). The storage integrated circuit chip (122) is electrically connected to the at least one passive component (123). The control integrated circuit chip (121), the storage integrated circuit chip (122), and the at least one passive component (123) are packaged within the encapsulant (10). The chip pins (111) are partly packaged inside the encapsulant (10) and partly exposed outside of the encapsulant (10). Storage devices employing the semiconductor chip obviate the need for complex circuit design during production process, thus conserving production costs, and reducing production cycles. Furthermore, also provided is a storage device comprising the semiconductor chip.