发明名称 Laminating method and apparatus of multi-layers plate
摘要 PURPOSE: A multi-layer plate laminating method capable of rapidly correcting the location of substrates and a device thereof are provided to prevent inaccuracy due to stress remained inside liquid adhesive. CONSTITUTION: A multi-layer plate laminating method comprises a fixing portion(402), one or more of image capturing device(508), and a positioning module. The fixing portion orientates a first substrate(12) and a second substrate and includes an auxiliary portion which fixes the position of the first substrate based on the fixing portion. One or more of the image capturing devices obtain the location of the first substrate based on the second substrate. The positioning module adjusts locations according to the position of the first substrate based on the second substrate. The second substrate is located on the first substrate. The liquid adhesive is arranged between the first and second substrates and is naturally distributed. The positioning module includes an x- coordinate controlling unit(504), an y- coordinate controlling unit(502), and &thgr;- coordinate controlling unit(506).
申请公布号 KR20120132616(A) 申请公布日期 2012.12.06
申请号 KR20120012006 申请日期 2012.02.06
申请人 发明人
分类号 B32B41/00;B32B37/12;B32B38/00 主分类号 B32B41/00
代理机构 代理人
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