STEREOSCOPIC IMAGE SENSOR PACKAGE AND METHOD FOR MANUFACTURING SAME

摘要

The present invention relates to a stereoscopic image sensor package and a method for manufacturing same. The stereoscopic image sensor package according to the present invention includes: a transparent substrate; a left image sensor connected to a bottom surface of the transparent substrate in a flip chip bonding manner; a right image sensor spaced from the left image sensor and connected to the bottom surface of the transparent substrate in the flip chip bonding manner; a printed circuit board having a left receiving groove for receiving the left image sensor and a right receiving groove for receiving the right image sensor, the printed circuit board being connected to the bottom surface of the transparent substrate in the flip chip bonding manner. According to the present invention, an alignment error between the left image sensor and the right image sensor may be minimized to improve the quality of a stereoscopic image outputted from the stereoscopic image sensor. Also, the stereoscopic image sensor package may be reduced in thickness to satisfy important requirements for mobile devices which have to be light-weight, thin, small and compact.