发明名称 LOW TEMPERATURE FIREABLE THICK FILM SILVER PASTE
摘要 The present invention is directed to an electroconductive thick film paste composition comprising Ag and a Ph-free Bi-based glass frit both dispersed in an organic medium, wherein the paste is fireable at temperatures below 420° C. The paste is especially useful for forming electrodes on substrates such as glass or films, particularly electrochromic glass or films, that would be damaged by higher firing temperatures. The present invention is further directed to a device comprising an electrode formed from the paste composition and, in particular, to an electrochromic device comprising such an electrode.
申请公布号 US2012305859(A1) 申请公布日期 2012.12.06
申请号 US201213472182 申请日期 2012.05.15
申请人 HANG KENNETH WARREN;PYADA HENA;SAWHILL HOWARD T.;SKURSKI MICHAEL A.;WALDROP ROBERT PAUL;E I DU PONT DE NEMOURS AND COMPANY 发明人 HANG KENNETH WARREN;PYADA HENA;SAWHILL HOWARD T.;SKURSKI MICHAEL A.;WALDROP ROBERT PAUL
分类号 H01B1/22 主分类号 H01B1/22
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