A PROCESS TO MANUFACTURE THICK LAYERS OF RADIATION CURED ADHESIVES

摘要

The invention relates to a process to manufacture an adhesive layer in an easy to handle process, whereby the adhesive is applied in a molten state to a substrate in an amount to form a layer of 150 to 5000 µm and the adhesive is cured by UV-radiation whereby the adhesive comprises a polyurethane bearing at least one unsaturated curable group in the chain and the radiation source is preferably an UV-LED.