| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ceramic substrate having through holes which can be efficiently plated and which permits effective conductive parts consisting of plating metal to be advantageously formed therein, and to provide a ceramic green sheet having through holes which could advantageously yield such a ceramic substrate, as well as to provide an industrial method capable of manufacturing such a ceramic green sheet advantageously. <P>SOLUTION: The inner surface in an axial cross section of a through hole which is opened in a ceramic green sheet so as to penetrate from the surface to the reverse side thereof is shaped like a convex curved surface consisting of a smooth arcuate curved line projecting toward the inside of the hole, and a constricted part constituting the minimum diameter of the through hole formed with such a convex curved surface is located at a center part in the thickness direction of the ceramic green sheet. <P>COPYRIGHT: (C)2013,JPO&INPIT |
